PCB Capabilities

WE OFFER A FULL RANGE OF PRINTED CIRCUIT BOARD CAPABILITIES TO FIT ALL OF YOUR PCB NEEDS

eSupply Industrial is a professional quick turn PCB prototyping and low-volume production manufacturer located in Shenzhen China. Currently we only accept 4 PCB files format( gerber file, .pcb, .pcbdoc or .cam file format) for PCB fabrication.

In order for us to keep our products and services competitive, we constantly are updating our equipments to better serve our customers.

Click above to order your PCB prototype or low-volume orders online, and you will be asked to upload your PCB files in ( gerber file, .pcb, .pcbdoc or .cam file format) before check out.

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Description Processing Capacity Detailed process Illustration
Number of layers
1~6 layers

The number of layers refers to the number of electrical
layers in the PCB (number of copper layers).
At present, we only accepts 1~6 laminates

Multilayer board impedance

4 layer, 6 layer

multilayer board supports impedance design, impedance board may have charge extra

Board Material
FR4 material
Plate type: cardboard, semi-glass fiber, full glass (FR-4), aluminum substrate, currently Jiali create only FR-4 plate. As shown on the right

production process
FR4 material
Traditional tin plating process
biggest size
40cm * 50cm
The cutting and cutting work board size is 40cm * 50cm, usually allow the customer’s PCB design size within 38cm * 38cm, the specific document review shall prevail.
Solder resistance type
Photosensitive ink
Photosensitive inks are the most commonly used type. Thermoset oils are generally used in low-grade single-sided paperboards. As shown on the right

Finished product copper thickness (outer)
1oz~2oz (35um~70um)
The default thickness of the conventional circuit board copper foil circuit is 1 oz, up to 2 oz. As shown on the right

For example: 4 layer board

Finished product copper thickness (inner)
0.5oz(17um)
The default conventional board is 0.5 oz. As shown on the right

For example: 4 layer board

Dimensional accuracy
±0.2mm
Board shape tolerance ± 0.2mm
Thickness range
0.4~2.0mm
currently produces plate thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm。
Plate thickness tolerance (T≥1.0mm)
± 10%
For example, the board thickness T = 1.6mm, the physical board thickness is 1.44mm(T-1.6×10%)~1.76mm(T+1.6×10%)
Plate thickness tolerance (T<1.0mm)
±0.1mm
0.7mm(T-0.1)~0.9mm(T+0.1)
Bore hole drilling (mechanical drill
0.2~6.3mm
The minimum hole diameter is 0.2mm, and the maximum hole diameter is 6.3mm. If it is larger than 6.3mm, the factory must deal with it separately. The specifications of the mechanical drill are 0.05mm for the first order, such as 0.2, 0.3m

Aperture tolerance (machine drill)
±0.08mm
The tolerance for drilling is ±0.08mm. For example, if the hole is designed to be 0.6mm, the finished product hole diameter of the physical plate is acceptable in the range of 0.52–0.68mm.
Line width
3.5mil
Multilayer PCB 3.5mil Single and Dual Panel 5 mil

Line gap
3.5mil
Multilayer PCB 3.5mil Single and Dual Panel 5 mil

Minimum bore inner diameter and outer diameter
The minimum diameter(inner) is 0.2mm and the diameter(outer) is 0.45mm
Multilayer PCB minimum inner diameter 0.2mm, minimum outer diameter 0.45mm, double panel minimum inner diameter 0.3mm, minimum outer diameter 0.6mm

Pad edge to line distance
5mil
The parameter is the limit value, try to be greater than this parameter

Through hole unilateral welding ring
3mil
The parameter is the limit value, try to be greater than this parameter

Minimum character width
Line width 6mil Character height 32mil
The parameter is the limit value, try to be greater than this parameter

Single Shipment: Distances Between Traces and Pads
≥0.2mm
Otherwise it may involve wiring and pads inside the board

Panel V cut shipment: Trace and pad distance from board edge
≥0.4mm
Otherwise it may involve lines and pads in the board, as shown in the right figure. If it is imposition, the line must be 0.4mm apart from the edge, otherwise vcut will hurt the line. If it is a single shipment, you need to help ≥ 0.2mm spacing.

Smallest Dummy Size
3mm

Panel: No gaps
0mm gap plate
The gap between the board and the board is 0mm
Panel: There is a gap
1.6mm gap plate
There should not be less than 2.0mm gap clearance, otherwise it is difficult
Half hole process minimum aperture
0.6mm
The semi-hole process is a special process and the minimum hole diameter must not be less than 0.6mm. Less than 0.6MM can not do half-hole effect
Solder mask window
0.05mm
The green oil bridge is less than 3 mils, the green oil bridge is larger than 3 mils, and the inspection standard is not based on the solder bridge.
Note 1: Pads factory copper method
Hatch mode copper
Manufacturers adopt Hatch, and customers of PADS software must pay attention. As shown on the right
Note 2: Pads software slot
With Outline line
If there are more non-metallized slots on the board, please use outline

4-LAYER PCB STANDARD STACKUP

Thinkness Copper Thickness Laminated Chart
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um

Instruction:
1. Above stackup lists are our factory’s standard stackup of 4-layer PCB.
2. The outer and inner copper thickness of 0.8-2.0mm PCB are both 1oz, while 0.6mm PCB only has 0.5oz inner copper thickness.
3. 1.6mm and 2.0mm PCB can be made with 2OZ outer copper thickness and 1.5OZ inner copper thickness.
4. When copper thickness increases, the dielectric layer will be reduced correspondingly, and the final board thickness will have positive and negative tolerance ±0.1mm.
5. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager!

6-LAYER PCB STANDARD STACKUP

Thinkness Copper Thickness Laminated Chart
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um

Instruction:
1. Above stackup lists are our factory’s standard stackup of 6-layer PCB.
2. The outer and inner copper thickness of 1.0-2.0mm PCB are both 1oz, while 0.8mm PCB only has 0.5oz inner copper thickness.
3. 1.6mm and 2.0mm PCB can be made with 2OZ outer copper thickness and 1.5OZ inner copper thickness.
4. When copper thickness increases, the dielectric layer will be reduced correspondingly, and the final board thickness will have positive and negative tolerance ±0.1mm.
5. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager!

8-LAYER PCB STANDARD STACKUP

Thinkness Copper Thickness Laminated Chart
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um
1.6mm±0.1mm
1oz

Copper 1 35 um
Dielectric 1-2 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm (6x 7628M 43% Resin) TG150 dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm (e.g. 1x Prepreg 7628 AT05 47% Resin) TG130 dielectric constant 4.29
Copper 4 35 um

Instruction:
1. Above stackup lists are our factory’s standard stackup of 8-layer PCB.
2. The outer and inner copper thickness of 1.2-2.0mm PCB are both 1oz, while 1.0mm PCB only has 0.5oz inner copper thickness.
3. 1.6mm and 2.0mm PCB can be made with 2OZ outer copper thickness and 1.5OZ inner copper thickness.
4. When copper thickness increases, the dielectric layer will be reduced correspondingly, and the final board thickness will have positive and negative tolerance ±0.1mm.
5. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager!

OFFERS RAPID PCB PROTOTYPING AND SMALL-VOLUME PRODUCTION FOR YOUR RESEARCH WORK, PILOT RUN AND LOW-VOLUME PRODUCTION TO TRIAL MARKET.

quick turnaround pcb

Having been in the PCB industry for 12 years, we prides as one of leading suppliers of PCB prototyping and low-volume production in the world. Our turn time can be as short as 12 hours after your Gerber files being reviewed and approved by our engineers, greatly saving you time in your work.

You may choose other time schedules to fit your budget, if your work time frame is not that tight. We offer 24-hours and 48-hours shipping too.

Being quick in delivery never compromises on the quality. With our stringent test procedures, you can be assured that you will be satisfied with our PCB for your high-tech work. Apart from the quality, we can almost beat every other fabricators on prices, which is critical for your work as you may need tens of hundreds of PCBs to finalize your research and design.

Try our online instant quote system to let you know how competitive our PCBs are. Start now!

UL certification 

All printed circuit boards made by eSupply Industrial are manufactured using a UL 796 certified process according to ZPMV2. These printed circuit boards can be used into UL approved products.

Our UL identification number is: E489269

 

ISO 9001:2008

ISO 9001:2008 certification has been in place for over a decade now and is used by both customers and companies as a method of controlling their quality.

The Standard provides a framework to manage your business and ensure a philosophy of continual improvement in all aspects of your business.

It is externally assessed on an ongoing basis to ensure these business practices are maintained.

Certification of CAN17-175608-02_EC_18317043_F

CAN17-175608-02_EC_18317043_F

Certification of CAN17-175608-04_EC_18317043_F

CAN17-175608-04_EC_18317043_F